Method for connecting leader line

ABSTRACT

Disclosed is a method for connecting a core wire of a wire rod covered with an insulating coating and pulled out from a coil component with a substrate by irradiating a laser beam, the method comprising the steps of: (a) forming a bond part between the wire rod and the substrate, the bond part being made of a material having a high optical absorptance for laser beam; and (b) irradiating a laser beam on an area to be connected under a state that at least one of the wire rod and the substrate is being pulled toward the other.

This is a Continuation of application Ser. No. 13/561,814 filed Jul. 30,2012, which claims priority to Japanese Patent Application No.2011-186493 filed Aug. 29, 2011. The disclosure of the priorapplications are hereby incorporated by reference herein in theirentireties.

TECHNICAL FIELD

The present invention relates to a method for connecting a leader line,in particular, to a method for connecting a core wire of a wire rod ofwire material pulled out from a coil component to a substrate such as aterminal by irradiating a laser beam.

BACKGROUND ART

In general, a method, which has been known as a method for connecting acore wire of a wire rod to a substrate such as a terminal, includes:winding a wire rod having an insulating coating formed on the peripheryof the core wire around a substrate such as a terminal, followed bysoaking the wire rod in a solder tub, removing the insulating coatingfrom the wire rod by melting the insulating coating under the meltingheat of the solder; and adhesion-fixing copper or the like, which is thecore wire of the wire rod, to the substrate such as the terminal.

Miniaturization and operating environment of electronic apparatus havebecome severe in recent years. The operating environment of electroniccomponents, such as a coil incorporated therein, has also becomeextremely severe. Therefore, the high heat resistance of the electroniccomponent itself has been also requested simultaneously withminiaturization of electronic components. In order to respond to suchdemands, for example, there is no way to avoid the use of a wire havingan insulating coating with high heat resistance on the periphery of itscore wire and the use of a thin wire as a wire rod for theminiaturization of electronic components. However, when connecting awire rod to a substrate such as a terminal, mechanical removal of aninsulating coating tends to cause wire disconnection. On the other hand,in the case of removal of the insulating coating of a wire rod bymelting with the melting heat of solder, there is a problem ofdifficulty in placing a miniaturized substrate into a solder tub.

In recent years, therefore, other methods have been proposed, where aninsulating coating on the periphery of a core wire of a wire rod isdelaminated therefrom by burning with laser beam irradiation, andsimultaneously the core wire of the wire rod is connected to a substratesuch as a terminal.

For instance, Japanese Laid-Open Patent Publication No. 3-155300 (JP3-155300 A) discloses a method including: previously applying solder toa lead wire installed in a coil bobbin to form a solder layer; winding awire rod around the lead wire, the wire rod being pulled out from a coilcomponent and covered with an insulating coating; melting the solderlayer portion by laser beam irradiation thereon; and burning aninsulating coating with the melting heat of solder to remove theinsulating coating, while connecting the wire rod to the lead wire. Thismethod allows soldering operation to be flexible even if electroniccomponents are miniaturized, compared with other conventional methodswhere soaking in a solder tub is employed for connection.

SUMMARY OF INVENTION Technical Problem

However, the invention disclosed in JP 3-155300 A, a leader line from acoil is only wound around a lead wire which is provided with a solderlayer by application of solder. Therefore, removal of the insulatingcoating and adhesion between the lead wire and the leader line from thecoil are not always performed in a reliable manner even if performed bylaser beam irradiation, resulting in problem in reliability.

Accordingly the present invention has been made in consideration of theaforementioned problem, and it is an object of the present invention toprovide a method for connection of a leader line, which is able toremove an insulating coating from a wire rod pulled out from a coilcomponent and ensure adhesive fixation between the core wire of the wirerod and a substrate.

Solution to Problem

Embodiments of the present invention have been proposed to attain theabove object. One aspect of the present invention is a method forconnecting a core wire of a wire rod covered with an insulating coatingand pulled out from a coil component with a substrate, the methodcomprising the steps of: (a) forming a bond part between the wire rodand the substrate, the bond part being made of a material having a highoptical absorptance for laser beam; and (b) irradiating a laser beam onan area to be connected under a state that at least one of the wire rodand the substrate is being pulled toward the other.

The bond part may be formed of a material containing at least tin.

The insulating coating may be colored blue or green.

Advantageous Effects of Invention

According to one aspect of the present invention, a wire rod is arrangedon the substrate via the bond part formed of the material having a highoptical absorptance for laser beam. A laser beam is then irradiated onan area to be connected between the bond part and the wire rod whileforce is applied so that at least one of the wire rod and the substrateis pulled toward the other. As a result, the bond part arranged betweenthe wire rod and the substrate generates heat. The heat burns theinsulating coating of the wire rod adhesively arranged on the bond part,and simultaneously melts the bond part. Subsequently, a core wire of thewire rod sinks into the bond part, and the periphery of the core wire iscovered by the bond part. A series of these actions makes possible toremove the insulating covering from the wire rod and to adhesively fixthe substrate on the core wire on the wire rod together, simultaneously.Consequently, these procedures can be easily performed with highaccuracy.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional diagram schematically illustrating a leaderconnector for carrying out a method for connecting a leader lineaccording to one embodiment of the present invention; and

FIG. 2 is an explanatory diagram sequentially illustrating the steps ofthe method for connecting a leader line according to the embodiment ofthe present invention.

DESCRIPTION OF EMBODIMENTS

Hereinafter, a mode for carrying out the invention (hereinafter,referred to as an “embodiment”) will be described in detail withreference to the attached drawings.

FIG. 1 is a cross-sectional diagram schematically illustrating anexemplary leader connector for carrying out a method for connecting aleader line according to an embodiment of the preset invention. Asdepicted in FIG. 1, a leader connector 10 includes a laser beamirradiator 11 for irradiation of a laser beam. A printed circuit board16 is placed under the laser beam irradiator 11. On the printed circuitboard 16, a wire rod 12, which is pulled out from a coil component (notshown), and a substrate (such as a terminal formed as a wiring patternor the like) 15, which is to be connected to the wire rod 12 via a bondpart 14, are arranged. Here, for example, the printed circuit 16 may bea glass epoxy board. The substrate 15 may be formed by, for example,application of phosphor bronze or the like is applied to the printcircuit board 16; or plating, coating, or printing of a conductive metalon any of other metals (e.g., materials such as plated tin, copper,silver, cadmium, and composites thereof).

The core rod 12 includes a conductive core wire 12 a made of copper orthe like. The periphery of the core wire 12 a is covered with aninsulating coating 13 made of polyurethane, polyimide, or the like.

The laser beam irradiator 11 is configured to irradiate a laser beam onthe bond part 14 and keep the irradiation in a state that the wire rod12 is pulled toward the bond part 13 (i.e., pulled toward the substrate15) to place them under tension T.

FIG. 2 is a diagram sequentially illustrating the steps of an exemplaryconnection method using the leader connector 10 depicted in FIG. 1. Inthe figure, the core wire 12 a of the wire rod 12 pulled out from thecoil component (not shown) is adhesion-fixed on the substrate 15 via thebond part 14. Hereafter, the connection steps (a) to (d) will bedescribed in this order with reference to FIG. 2.

First, using a known coating technique or the like, the bond part 14formed of a material having a high optical absorptance for laser beam isplaced on the substrate 15 of the printed circuit board 16 (step (a)).

Next, under force that is tension T for pulling the wire rod 12, whichhas been pulled out from the coil component, toward the substrate 15,the wire rod 12 is placed on the bond part 14 on the substrate 15 and alaser beam is then irradiated on an area to be connected where the wirerod 12 and the substrate 15 are to be connected to each other via thebond part 14 (step (b)). In the figure, reference sign “t” denotes“reaction force” acting from the bond part 14 to the wire rod 12.

Tension T is applied so that the wire rod 12 can be pulled toward thesubstrate 15, while a laser beam is irradiated on the area to beconnected. As a result, the bond part 14 absorbs the laser beam andgenerates heat. Subsequently, the heat burns out the insulating coating13 of the wire rod 12, which is in contact with the bond part 14. Then,the core wire 12 a is exposed and the bond part 14 starts to melt (step(c)).

The bond part 14 can be further softened by successively irradiating thelaser beam on the bond part 14 while applying tension T so as to pullthe wire rod 12 toward the substrate 15. Due the presence of reactionforce t as well as tension T pulling the wire rod 12 toward thesubstrate 15, the core wire 12 a of the wire rod 12, which faces thesubstrate 15, sinks into the bond part 14. Thus, the periphery of thecore wire 12 a is brought into a state of being covered with the bondpart 14. After that, the laser beam irradiation is stopped to cool andsolidify the bond part 14, completing the adhesion-fixing between thecore wire 12 a of the wire rod 12 and the substrate 15 (step (d)).

Therefore, by completing the above steps (a) to (d), the removal of theinsulating coating 13 from the wire rod 12 and the adhesion-fixingbetween the core wire 12 a and the substrate 15 while being kept inconductive state can be simultaneously attained. Therefore, the removalof the insulating coating 13 from the wire rod 12 and the adhesionfixing between the core wire 12 a and the substrate 15 can be performedin a complete manner.

In summary, according to the present embodiment, the wire rod 12 isarranged on the substrate 15 via the bond part 14 formed of the materialhaving a high optical absorptance for laser beam. A laser beam is thenirradiated on the area to be connected while force is applied so that atleast one of the wire rod 12 and the substrate 15 is pulled toward theother. Then, heat is generated from the bond part 14 which is formed byapplication or the like. The heat burns the insulating coating 13arranged in close contact with the bond part 14, causing the core wire12 a of the wire rod 12 to be exposed. Simultaneously, the bond part 14melts and becomes soft. Since the core wire 12 a of the wire rod 12 ispulled toward the substrate 15, the core wire 12 a of the wire rod 12,which faces the substrate 15, sinks into the bond part 14. Thus, theperiphery of the core wire 12 a is brought into a state of being coveredwith the bond part 14. A series of these actions makes possible toremove the insulating coating 13 from the wire rod 12 and to adhesivelyfix the core wire 12 a and the substrate 15 together while being kept inconductive state can be simultaneously attained.

The bond part 14 may be formed of any material as long as it is easy toabsorb laser beams. Among the materials, for example, it may be formedof only tin or a tin-containing material.

Tin is applicable to soldering while having a high optical absorptancefor laser beam. Therefore, removal of the insulating coating 13 from thewire rod 12 and adhesive fixing between the core wire 12 a and thesubstrate 15 can be much more easily performed with high accuracy.

The laser beam may be any of beams of solid state laser, gas laser, andliquid laser, or more specifically, for example, any of beams of carbondioxide gas laser, semiconductor laser, excimer laser, and YAG laser.

In this embodiment, with respect to an area on which a laser beam isdirectly irradiated on the insulating coating 13, it is preferable thatthe wire rod 12 to be used may have a blue- or green-colored insulatingcoating 13 to facilitate removal of the insulating coating 13.Alternatively, any of other colors, such as natural color (daytimecolor) may be applicable.

The use of blue- or green-colored insulating coating 13 facilitatesremoval of the insulating coating 13 more easily by allowing theinsulating film 13 being separated during the laser beam irradiation.

In the above description, the bond part 14 has been described as onebeing formed by application or the like on the substrate 15.Alternatively, however, it may be applied to the periphery of the wirerod 12 or may be applied to both the substrate 15 and the wire rod 12.

In the above description, tension T has been described as one forpulling the wire rod 12 toward the substrate 15. Conversely, tension Tmay be applied for pulling the substrate 15 toward the wire rod 12.

The scope of the present invention is not limited to the aboveembodiment. It goes without saying that the present invention can beimplemented in various modified modes without departing from the gist ofthe present invention.

1. A method for connecting a core wire of a wire rod pulled out from acoil component with a substrate by irradiating a laser beam, the methodcomprising the steps of: (a) forming a bond part between the wire rodand the substrate, the wire rod being placed on the bond part which isformed on the substrate; and (b) irradiating a laser beam on an area tobe connected where the wire rod and the substrate are to be connected toeach other via the bond part, under a state that at least one of thewire rod and the substrate is being pulled toward the other, wherein thelaser beam is irradiated on the area to be connected so that the bondpart melts, and the core wire of the wire rod sinks into the bond part.2. The method according to claim 1, wherein the bond part is formed of amaterial having a high optical absorptance for laser beam.
 3. The methodaccording to claim 2, wherein the bond part is formed of a materialcontaining at least tin.
 4. The method according to claim 1, wherein aperiphery of the core wire of the wire rod is covered by the bond part.